Conductors: Made from high-purity oxygen-free copper or silver-plated copper, ensuring low resistance and high conductivity.
Insulation Layer: Composed of materials such as PE, FEP, or silicone, which resist high and low temperatures (-40°C to 125°C) and chemical corrosion, effectively isolating signal interference.
Wire Groups: Featuring multi-core designs with independent channels, along with connectors that have a foolproof design and precision terminals, ensuring stable connections and preventing misinsertion.